NC

IO1

IO2

NC

1

2

3

5

4

GND

TPD2E2U06

www.ti.com

SLLSEG9B – JUNE 2013 – REVISED MAY 2015

6 Pin Configuration and Functions

DRL

1.65 mm × 1.2 mm × 0.6 mm

(0.5-mm PITCH)

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

IO1

3

I/O

The IO1 and IO2 pins are an ESD protected channel. Connect these pins to the data line as

close to the connector as possible.

IO2

5

I/O

NC

1, 2

-

This pin is not connected and is left floating, grounded, or connected to VCC.

GND

4

G

The GND (ground) pin is connected to ground.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Peak pulse current (tp = 8/20

μs)

A

Peak pulse power (tp = 8/20

μs)

W

Operating temperature

–40

125

°C

Storage temperature

–65

155

°C

(1)

Measured at 25°C.

7.2 ESD Ratings

VALUE

UNIT

±4000

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

Electrostatic discharge

V

EC 61000-4-2 contact

±25000

EC 61000-4-2 air-gap

±30000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input Pin Voltage

0

5.5

V

Operating Free Air Temperature

-40

125

°C

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