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AM26LS31CDBRE4 数据表(PDF) 4 Page - Texas Instruments |
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AM26LS31CDBRE4 数据表(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 AM26LS31, AM26LS31C, AM26LS31I, AM26LS31M SLLS114K – JANUARY 1979 – REVISED JULY 2016 www.ti.com Product Folder Links: AM26LS31 AM26LS31M Submit Documentation Feedback Copyright © 1979–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential output voltage VOD, are with respect to network GND. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage(2) 7 V VI Input voltage 7 V Output off-state voltage 5.5 V Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C Lead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VCC Supply voltage AM26LS31C 4.75 5 5.25 V AM26LS31M 4.5 5 5.5 VIH High-level input voltage 2 V VIL Low-level input voltage 0.8 V IOH High-level output current –20 mA IOL Low-level output current 20 mA TA Operating free-air temperature AM26LS31C 0 70 °C AM26LS31I –40 85 AM26LS31M –55 125 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) The package thermal impedance is calculated in accordance with JESD 51-7. 6.4 Thermal Information THERMAL METRIC(1) AM26LS31x UNIT D (SOIC) DB (SSOP) N (PDIP) NS (SO) 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance(2) 73 82 67 64 °C/W RθJC(top) Junction-to-case (top) thermal resistance 38.1 – – 32.6 °C/W RθJB Junction-to-board thermal resistance 34.7 – – 36.8 °C/W ψJT Junction-to-top characterization parameter 7.1 – – 4.2 °C/W ψJB Junction-to-board characterization parameter 34.4 – – 36.5 °C/W |
类似零件编号 - AM26LS31CDBRE4 |
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类似说明 - AM26LS31CDBRE4 |
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