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TLC25M4 数据表(PDF) 3 Page - Texas Instruments |
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TLC25M4 数据表(HTML) 3 Page - Texas Instruments |
3 / 28 page TLC254, TLC254A, TLC254B, TLC254Y, TLC25L4, TLC25L4A, TLC25L4B TLC25L4Y, TLC25M4, TLC25M4A, TLC25M4B, TLC25M4Y LinCMOS QUAD OPERATIONAL AMPLIFIERS SLOS003G – JUNE 1983 – REVISED MARCH 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 chip information These chips, when properly assembled, display characteristics similar to the TLC25_4C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VDD (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (11) VDD– /GND + – 3OUT 3IN + 3IN – (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN – BONDING PAD ASSIGNMENTS 68 108 (14) (13) (12) (11) (10) (9) (8) (7) (6) (5) (5) (4) (3) (2) (1) |
类似零件编号 - TLC25M4 |
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类似说明 - TLC25M4 |
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