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SN74AHCT367PW 数据表(PDF) 11 Page - Texas Instruments

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部件名 SN74AHCT367PW
功能描述  Hex Buffer and Line Driver with 3-State Output
Download  22 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

SN74AHCT367PW 数据表(HTML) 11 Page - Texas Instruments

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Vcc
Unused Input
Input
Output
Input
Unused Input
Output
SN74AHCT367
www.ti.com
SCLS418H – JUNE 1998 – REVISED DECEMBER 2014
12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 6 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when
asserted. This will not disable the input section of the I/Os so they also cannot float when disabled.
12.2 Layout Example
Figure 6. Layout Diagram
13 Device and Documentation Support
13.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL
TOOLS &
SUPPORT &
PARTS
PRODUCT FOLDER
SAMPLE & BUY
DOCUMENTS
SOFTWARE
COMMUNITY
SN74AHCT367
Click here
Click here
Click here
Click here
Click here
13.2 Trademarks
All trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1998–2014, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: SN74AHCT367


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