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LM3633YFQT 数据表(PDF) 4 Page - Texas Instruments |
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LM3633YFQT 数据表(HTML) 4 Page - Texas Instruments |
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4 / 59 page  LM3633 SNVS867 – JUNE 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN to GND −0.3 6 VSW, VOVP, VHVLED1, VHVLED2, VHVLED3 to GND −0.3 45 VSCL, VSDA, VPWM to GND −0.3 6 V VHWEN, VCPOUT to GND, VC–, VC+ −0.3 6 VLVLED1- VLVLED6, to GND −0.3 6 Internally Continuous power dissipation Limited Junction temperature (TJ-MAX) 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range −65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all −1000 1000 pins(1) V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification −250 250 JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN to GND 2.7 5.5 VSW, VOVP, VHVLED1, VVHLED2, VVHLED3 to GND, VPWM, VHWEN, VSDA, VSCL 0 40 V VLVLED1- VLVLED6 to GND 0 6 Junction temperature (TJ) (1) (2) −40 125 °C (1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and disengages at TJ= 125°C (typ.). (2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). 6.4 Thermal Information DSBGA THERMAL METRIC(1) UNIT (20 PINS) RθJA Thermal resistance junction-to-ambient 55.3 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LM3633 |
类似零件编号 - LM3633YFQT |
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类似说明 - LM3633YFQT |
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