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LM10507 数据表(PDF) 7 Page - Texas Instruments |
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LM10507 数据表(HTML) 7 Page - Texas Instruments |
7 / 40 page LM10507 www.ti.com SNVS999 – MAY 2014 7.6 Buck 1 Electrical Characteristics (1) (2) (3) (4) SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IQ DC Bias Current in VIN No Load, PFM Mode(5) 15 50 µA Continuous maximum load IOUT-MAX Buck 1 enabled, switching in PWM (5) 1.6 A current (6)(7)(8) IPEAK Peak switching current limit Buck 1 enabled, switching in PWM(5) 1.9 2.2 2.8 A η Efficiency peak, Buck 1 IOUT = 0.3A, VVIN = 5.0 V 90% FSW Switching Frequency(6) (5) 1.75 2 2.3 MHz CIN Input Capacitor (6) 4.7 µF Output Filter Capacitor (6) 10 10 100 COUT 0mA ≤ IOUT ≤ IOUT-MAX Output Capacitor ESR (6) 20 m Ω L Output Filter Inductance (6) 2.2 µH DC Line regulation (6) 3.3V ≤ VIN ≤ 5.0V, IOUT = IOUT-MAX 0.5 %/V ΔVOUT VVIN=5 V, 0.1 *IOUT-MAX≤ IOUT ≤ IOUT- DC Load regulation, PWM (6) 0.3 %/A MAX IFB Feedback pininput bias current VFB = 1 V (5) 1.2 5 µA VFB Feedback accuracy VFB =1 V (5) -3% 3% VIN =5.0 V 135 RDS-ON-HS High Side Switch On Resistance m Ω VIN = 2.6 V 215 RDS-ON-LS Low Side Switch On Resistance VVIN=5.0 V (5) 85 190 m Ω STARTUP Startup from shutdown, VOUT = 0V, no load, LC = recommended circuit, using TSTART_NoLoad Internal soft-start (turn on time) (6) 0.1 ms software enable, to VOUT = 95% of final value Startup from shutdown, VOUT = 0V, Maximum Load, LC = recommended TSTART_FullLoad Internal soft-start (turn on time) (6) 0.5 ms circuit, using software enable, to VOUT = 95% of final value (1) All limits are ensured by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested during production with TJ = 25°C. All hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical process control. (2) Capacitors: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics. (3) BUCK normal operation is ensured if VIN ≥ VOUT+1.0V. (4) Unless otherwise noted, VIN = 5.0V where: VIN = VVIN_B1 = VVIN_B2 = VVIN_B3. Limits apply for TJ = 25°C unless otherwise noted. (5) Limits apply over the entire operating junction temperature range of −30°C ≤TA = TJ ≤ +85°C. (6) Specification ensured by design. Not tested during production. (7) In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). (8) The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated using the formula: P = (TJ–TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to- ambient thermal resistance. θJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the device from permanent damage (see General Electrical Characteristics) Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM10507 |
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