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CDCM1802RGTRG4 数据表(PDF) 4 Page - Texas Instruments |
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CDCM1802RGTRG4 数据表(HTML) 4 Page - Texas Instruments |
4 / 30 page CDCM1802 SCAS759B – APRIL 2004 – REVISED NOVEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage −0.3 3.8 V VI Input voltage −0.2 (VDD + 0.2) V VO Output voltage −0.2 (VDD + 0.2) V Yn, Yn, IOSD Differential short circuit current Continuous TJ Maximum junction temperature 125 125 °C Tstg Storage temperature −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 3 3.3 3.6 V VDD Supply voltage (only functionality) 2.375 3.6 V TA Operating free-air temperature –40 85 °C 6.4 Thermal Information CDCM1802 THERMAL METRIC(1) RGT (VQFN) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 48.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66.9 °C/W RθJB Junction-to-board thermal resistance 22.5 °C/W ψJT Junction-to-top characterization parameter 1.7 °C/W ψJB Junction-to-board characterization parameter 22.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 5.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated Product Folder Links: CDCM1802 |
类似零件编号 - CDCM1802RGTRG4 |
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类似说明 - CDCM1802RGTRG4 |
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