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CDCM6208V2G 数据表(PDF) 2 Page - Texas Instruments |
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CDCM6208V2G 数据表(HTML) 2 Page - Texas Instruments |
2 / 88 page 2 CDCM6208V2G SNAS682 – MARCH 2016 www.ti.com Product Folder Links: CDCM6208V2G Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Simplified Schematics........................................... 1 5 Revision History..................................................... 2 6 Description (continued)......................................... 3 7 Pin Configuration and Functions ......................... 3 8 Specifications......................................................... 6 8.1 Absolute Maximum Ratings ..................................... 6 8.2 ESD Ratings.............................................................. 6 8.3 Recommended Operating Conditions ....................... 7 8.4 Thermal Information, Airflow = 0 LFM ..................... 7 8.5 Thermal Information, Airflow = 150 LFM ................. 8 8.6 Thermal Information, Airflow = 250 LFM ................. 8 8.7 Thermal Information, Airflow = 500 LFM ................. 8 8.8 Single Ended Input Characteristics .......................... 9 8.9 Single Ended Input Characteristics (PRI_REF, SEC_REF) ................................................................. 9 8.10 Differential Input Characteristics (PRI_REF, SEC_REF) ............................................................... 10 8.11 Crystal Input Characteristics (SEC_REF) ............. 10 8.12 Single Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA) ............................................ 11 8.13 PLL Characteristics ............................................... 11 8.14 LVCMOS Output Characteristics .......................... 12 8.15 LVPECL (High-Swing CML) Output Characteristics ......................................................... 13 8.16 CML Output Characteristics .................................. 13 8.17 LVDS (Low-Power CML) Output Characteristics . 14 8.18 HCSL Output Characteristics............................... 14 8.19 Output Skew and Sync to Output Propagation Delay Characteristics ......................................................... 15 8.20 Device Individual Block Current Consumption...... 16 8.21 Worst Case Current Consumption ........................ 17 8.22 I2C TIMING .......................................................... 18 8.23 SPI Timing Requirements ..................................... 19 8.24 Typical Characteristics ......................................... 20 9 Parameter Measurement Information ................ 22 9.1 Characterization Test Setup ................................... 22 10 Detailed Description ........................................... 28 10.1 Overview ............................................................... 28 10.2 Functional Block Diagram ..................................... 28 10.3 Feature Description............................................... 29 10.4 Device Functional Modes...................................... 30 10.5 Programming......................................................... 38 10.6 Register Maps ....................................................... 42 11 Application and Implementation........................ 54 11.1 Application Information.......................................... 54 11.2 Typical Applications .............................................. 54 12 Power Supply Recommendations ..................... 73 12.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains .................................... 73 13 Layout................................................................... 75 13.1 Layout Guidelines ................................................. 75 13.2 Layout Example .................................................... 75 14 Device and Documentation Support ................. 81 14.1 Documentation Support ....................................... 81 14.2 Community Resources.......................................... 81 14.3 Trademarks ........................................................... 81 14.4 Electrostatic Discharge Caution ............................ 81 14.5 Glossary ................................................................ 81 15 Mechanical, Packaging, and Orderable Information ........................................................... 81 5 Revision History DATE REVISION NOTES March 2016 * Initial release. |
类似零件编号 - CDCM6208V2G |
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类似说明 - CDCM6208V2G |
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