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SMP1320-099 数据表(PDF) 4 Page - Skyworks Solutions Inc. |
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SMP1320-099 数据表(HTML) 4 Page - Skyworks Solutions Inc. |
4 / 5 page DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 4 January 5, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140L Grip Ring 0.003 (0.076 mm) Separation Between Die 3.940 (100 mm) Wafer Dia. 5.520 (140.2 mm) Inner Ring I.D. 5.981 (151.92 mm) Outer Ring O.D. 0.236 (5.99 mm) Ring Thickness Wafer on nitto tape Color: light blue Thickness: 2.2 to 3.0 mils Tensile strength: 6.6 lbs (in width) Ring material: plastic 0.003 (0.076 mm) Nom. Separation Between Die Figure 5. Wafer Film Frame Description |
类似零件编号 - SMP1320-099 |
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类似说明 - SMP1320-099 |
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