10

100ç

0ç

150ç

200ç

300ç

50S

0S

100S

150S

200S

240

ç max.

220

ç

Preheating

Soldering

Preheating : 150ç 30 to 90 sec.

IR Reflow Conditions

Soldering : 235±5ç 10 sec. max.

220ç min. 10 to 20 sec.

Reflow system

: IR reflow

Solder

: Paste type 63 Sn/37 Pb (Flux content 9 wt%)

Test board

: Glass epoxy 60mm x 100mm x 1.6 mm

Metal mask thickness

: 0.15 mm

Recommended temperature.

The temperature may be slightly changed according to the solder paste type and volume used.

sRecommended Temperature Profile