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CB1G-10S-1.5H-PEJC2 数据表(PDF) 10 Page - Hirose Electric |
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CB1G-10S-1.5H-PEJC2 数据表(HTML) 10 Page - Hirose Electric |
10 / 10 page 10 100ç 0ç 150ç 200ç 300ç 50S 0S 100S 150S 200S 240 ç max. 220 ç Preheating Soldering Preheating : 150ç 30 to 90 sec. IR Reflow Conditions Soldering : 235±5ç 10 sec. max. 220ç min. 10 to 20 sec. <Recommended Conditions> Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 9 wt%) Test board : Glass epoxy 60mm x 100mm x 1.6 mm Metal mask thickness : 0.15 mm Recommended temperature. The temperature may be slightly changed according to the solder paste type and volume used. sRecommended Temperature Profile |
类似零件编号 - CB1G-10S-1.5H-PEJC2 |
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类似说明 - CB1G-10S-1.5H-PEJC2 |
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