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CSD19532KTT 数据表(PDF) 9 Page - Texas Instruments |
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CSD19532KTT 数据表(HTML) 9 Page - Texas Instruments |
9 / 12 page 42X (0.97) 42X (0.95) (1.17) TYP (1.15) TYP (0.48) TYP (6.9) (5.08) (R ) TYP 0.05 2X (3.82) 2X (1.05) SYMM PKG 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND (7.48) (8.55) 2X (3.82) 2X (1.05) (3.4) (6.9) (5.08) (R ) TYP 0.05 PKG SYMM PKG OPENING SOLDER MASK METAL NON SOLDER MASK DEFINED SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED CSD19532KTT www.ti.com SLPS553 – OCTOBER 2015 7.2 Recommended PCB Pattern For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques. 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness) Notes: 1. This package is designed to be soldered to a thermal pad on the board. See application notes, PowerPAD Thermally Enhanced Package (SLMA002) and PowerPAD Made Easy (SLMA004) for more information. 2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 3. Board assembly site may have different recommendations for stencil design. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: CSD19532KTT |
类似零件编号 - CSD19532KTT |
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类似说明 - CSD19532KTT |
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