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LM25066 数据表(PDF) 5 Page - Texas Instruments |
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LM25066 数据表(HTML) 5 Page - Texas Instruments |
5 / 63 page LM25066 www.ti.com SNVS654J – FEBRUARY 2010 – REVISED DECEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, SENSE to GND(2) –0.3 24 V GATE, FB, UVLO/EN, OVLO, PGD to GND (2) –0.3 20 V OUT to GND –1 20 V Input voltage SCL, SDA, SMBA, CL, CB, ADR0, ADR1, ADR2, VDD, VAUX, –0.3 6 V DIODE, RETRY to GND VIN to SENSE –0.3 0.3 V Junction temperature, TJ 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The GATE pin voltage is typically 7.5 V above VIN when the LM25066 is enabled. Therefore, the Absolute Maximum Rating of 24 V for VIN and SENSE apply only when the LM25066 is disabled or for a momentary surge to that voltage since the Absolute Maximum Rating for the GATE pin is 20 V. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN, SENSE, OUT voltage 2.9 17 V VDD 2.9 5.5 V Junction temperature, TJ –40 125 °C 7.4 Thermal Information LM25066 THERMAL METRIC(1) NHZ (WQFN) UNIT 24 PINS RθJA Junction-to-ambient thermal resistance 34.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 28.9 °C/W RθJB Junction-to-board thermal resistance 13.4 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 13.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM25066 |
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类似说明 - LM25066 |
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