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AD6672 数据表(PDF) 10 Page - Analog Devices

部件名 AD6672
功能描述  IF Receiver
Download  30 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

AD6672 数据表(HTML) 10 Page - Analog Devices

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AD6672
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
Electrical
AVDD to AGND
−0.3 V to +2.0 V
DRVDD to AGND
−0.3 V to +2.0 V
VIN+, VIN− to AGND
−0.3 V to AVDD + 0.2 V
CLK+, CLK− to AGND
−0.3 V to AVDD + 0.2 V
VCM to AGND
−0.3 V to AVDD + 0.2 V
CSB to AGND
−0.3 V to DRVDD + 0.3 V
SCLK to AGND
−0.3 V to DRVDD + 0.3 V
SDIO to AGND
−0.3 V to DRVDD + 0.3 V
0/D0−, 0/D0 + Through D9−/D10−,
D9+/D10+ to AGND
−0.3 V to DRVDD + 0.3 V
OR+/OR− to AGND
−0.3 V to DRVDD + 0.3 V
DCO+, DCO− to AGND
−0.3 V to DRVDD + 0.3 V
Environmental
Operating Temperature Range
(Ambient)
−40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
−65°C to +125°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for the
LFCSP package. Soldering the exposed paddle to the customer
board increases the reliability of the solder joints, maximizing
the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
θJA1, 2
θJC1, 3
θJB1, 4
Unit
32-Lead LFCSP
5 mm × 5 mm
(CP-32-12)
0
37.1
3.1
20.7
°C/W
1.0
32.4
°C/W
2.0
29.1
°C/W
1
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow increases heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces—through holes, ground, and
power planes—reduces the θJA.
ESD CAUTION
Rev. C | Page 10 of 30


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