SN74AVCH4T245

SCES577E – JUNE 2004 – REVISED NOVEMBER 2015

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Recommended Operating Conditions (continued)

see

(1)(2)(3)(4)(5)

MIN

MAX

UNIT

1.2 V to 1.95 V

Low-level

DIR

1.95 V to 2.7 V

0.7

V

input voltage

(5)

2.7 V to 3.6 V

0.8

Input voltage

0

3.6

V

Active state

0

Output voltage

V

3-state

0

3.6

1.2 V

–3

1.4 V to 1.6 V

–6

High-level output current

1.65 V to 1.95 V

–8

mA

2.3 V to 2.7 V

–9

3 V to 3.6 V

–12

1.2 V

3

1.4 V to 1.6 V

6

Low-level output current

1.65 V to 1.95 V

8

mA

2.3 V to 2.7 V

9

3 V to 3.6 V

12

Δt/Δv

Input transition rise or fall rate

5

ns/V

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

SN74AVCH4T245

D (SOIC)

DGV

PW

RGY

RSV

UNIT

(TVSOP)

(TSSOP)

(VQFN)

(UQFN)

16 PINS

16 PINS

16 PINS

16 PINS

16 PINS

85.5

126.0

112.0

37.5

146.9

°C/W

46.9

50.8

46.8

54.5

53.6

°C/W

Junction-to-board thermal resistance

43.0

57.7

57.1

15.6

75.6

°C/W

Junction-to-top characterization parameter

13.4

5.7

5.7

0.5

13.5

°C/W

Junction-to-board characterization parameter

42.7

57.2

56.5

15.8

75.6

°C/W

—

—

—

3.5

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

6

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