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DAC3484IRKDT 数据表(PDF) 11 Page - Texas Instruments |
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DAC3484IRKDT 数据表(HTML) 11 Page - Texas Instruments |
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11 / 107 page  DAC3484 www.ti.com SLAS749E – MARCH 2011 – REVISED NOVEMBER 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT DACVDD, DIGVDD, CLKVDD –0.5 1.5 V VFUSE –0.5 1.5 V Supply voltage range(2) IOVDD –0.5 4 V AVDD, PLLAVDD –0.5 4 V D[15..0]P/N, DATACLKP/N, FRAMEP/N, PARITYP/N, SYNCP/N –0.5 IOVDD + 0.5 V DACCLKP/N, OSTRP/N –0.5 CLKVDD + 0.5 V ALARM, SDO, SDIO, SCLK, SDENB, SLEEP, RESETB, TESTMODE, –0.5 IOVDD + 0.5 V TXENABLE Pin voltage range(2) IOUTAP/N, IOUTBP/N, IOUTCP/N, IOUTDP/N –1.0 AVDD + 0.5 V EXTIO, BIASJ –0.5 AVDD + 0.5 V LPF 0.5 PLLAVDD+0.5V V Peak input current (any input) 20 mA Peak total input current (all inputs) –30 mA Operating free-air temperature range, TA: DAC3484 –40 85 °C Absolute maximum junction temperature, TJ 150 °C Storage temperature range –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Measured with respect to GND. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT Recommended operating junction temperature 105 TJ °C Maximum rated operating junction temperature(1) 125 TA Recommended free-air temperature –40 25 85 °C (1) Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate. Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: DAC3484 |
类似零件编号 - DAC3484IRKDT |
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类似说明 - DAC3484IRKDT |
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