TPA3110D2-Q1

SLOS794B – SEPTEMBER 2012 – REVISED SEPTEMBER 2015

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Pin Functions (continued)

PIN

TYPE

DESCRIPTION

NO.

NAME

Power supply for left channel H-bridge. Right channel and left channel power supply inputs

27

PVCCL

P

are connect internally.

Power supply for left channel H-bridge. Right channel and left channel power supply inputs

28

PVCCL

P

are connect internally.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

AVCC, PVCC

–0.3

30

V

–0.3

V

< 10

V/ms

Interface pin

voltage

PLIMIT

–0.3

GVDD + 0.3

V

RINN, RINP, LINN, LINP

–0.3

6.3

V

BTL: PVCC > 15 V

4.8

Minimum load

BTL: PVCC

≤ 15 V

3.2

resistance

PBTL

3.2

Continuous total power dissipation

See the Thermal Information Table

Operating free-air temperature

–40

125

°C

–40

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-k

Ω resistor in series

with the pins, per application note SLUA626.

(3)

The TPA3110D2-Q1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be

connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal

protection shutdown. See TI Technical Brief SLMA002 for more information about using the TSSOP thermal pad.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic discharge

Charged-device model (CDM), per AEC Q100-011

±250

V

Machine Model (MM) per JESD22-A115

±200

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

PVCC, AVCC

8

26

V

High-level input voltage

SD, GAIN0, GAIN1, PBTL

2

V

Low-level input voltage

SD, GAIN0, GAIN1, PBTL

0.8

V

Low-level output voltage

0.8

V

High-level input current

50

µA

Low-level input current

5

µA

Operating free-air temperature

–40

125

°C

4

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