© 2012 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN53525 • Rev. 1.0.1

21

Physical Dimensions

Figure 39.

15-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x5 Array, 0.4 mm Pitch, 250 µm Ball

Product-Specific Dimensions

D

E

X

Y

2.015 ±0.03 mm

1.310 ±0.03 mm

0.255 mm

0.2075 mm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without

notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most

recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty

therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

B

A

BALL A1

INDEX

AREA

C

0.005

CA B

SIDE VIEWS

TOP VIEW

NOTES

A. NO JEDEC REGISTRATION APPLIES.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCE PER

ASME Y14.5 - 2009.

D. DATUM C IS DEFINED BY THE

SPHERICAL CROWNS OF THE BALLS.

E. PACKAGE NOMINAL HEIGHT IS

586 ± 39 MICRONS (547-625 MICRONS).

F. FOR DIMENSIONS D,E,X, AND Y SEE

PRODUCT DATASHEET.

G. DRAWING FILNAME: MKT-UC015AB Rev1

0.03 C

0.03 C

15X

BOTTOM VIEW

0.05 C

0.06 C

RECOMMENDED LAND PATTERN

(NSMD TYPE)

D

2X

2X

E

D

(Ø0.200)

Cu Pad

(Ø0.300)

Solder Mask

Opening

A1

Seating Plane

Ø0.260±0.02

(Y)±0.018

(X)±0.018

0.625

0.547

0.378±0.018

0.208±0.021

0.40

0.40

0.40

0.40

F

F

12 3

A

B

C

D

E

0.80

1.60

0.80

1.60