LM285-1.2, LM385-1.2, LM385B-1.2

SLVS075J – APRIL 1989 – REVISED JANUARY 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Reverse Current

30

mA

Forward Current

10

mA

Operating virtual junction temperature

150

°C

Storage temeprature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Reference current

0.01

20

mA

LM285-1.2

–40

85

Operating free-air temperature

°C

LM385-1.2, LM385B-1.2

0

70

7.4 Thermal Information

LMx85-1.2

D

LP

PS

PW

UNIT

8 PINS

3 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

97

140

95

149

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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