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LM285DR-1-2 数据表(PDF) 4 Page - Texas Instruments |
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LM285DR-1-2 数据表(HTML) 4 Page - Texas Instruments |
4 / 25 page LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT IR Reverse Current 30 mA IF Forward Current 10 mA TJ Operating virtual junction temperature 150 °C Tstg Storage temeprature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101, ±1000 all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT IZZ Reference current 0.01 20 mA LM285-1.2 –40 85 TA Operating free-air temperature °C LM385-1.2, LM385B-1.2 0 70 7.4 Thermal Information LMx85-1.2 THERMAL METRIC(1) D LP PS PW UNIT 8 PINS 3 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 97 140 95 149 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 |
类似零件编号 - LM285DR-1-2 |
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类似说明 - LM285DR-1-2 |
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