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LB1863M-TLM-H 数据表(PDF) 6 Page - ON Semiconductor |
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LB1863M-TLM-H 数据表(HTML) 6 Page - ON Semiconductor |
6 / 7 page LB1863M, LB1869M www.onsemi.com 6 Package Dimensions unit : mm SOIC14 W / MFP14S (225 mil) CASE 751CB ISSUE A SOLDERING FOOTPRINT* NOTE: The measurements are not to guarantee but for reference only. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (Unit: mm) 0.47 1.00 XXXXX = Specific Device Code Y = Year M = Month DDD = Additional Traceability Data GENERIC MARKING DIAGRAM* *This information is generic. Please refer to device data sheet for actual part marking. XXXXXXXXXX YMDDD to |
类似零件编号 - LB1863M-TLM-H |
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类似说明 - LB1863M-TLM-H |
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