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LM27761 数据表(PDF) 3 Page - Texas Instruments |
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LM27761 数据表(HTML) 3 Page - Texas Instruments |
3 / 9 page www.ti.com PACKAGE OUTLINE C A A SEE OPTIONAL TERMINAL 8X 0.3 0.2 1.6±0.1 2X 1.5 0.9±0.1 6X 0.5 8X 0.4 0.2 0.05 0.00 0.8 MAX A 2.1 1.9 B 2.1 1.9 0.3 0.2 0.4 0.2 (0.2) TYP (0.08) (0.05) WSON - 0.8 mm max height DSG0008B PLASTIC SMALL OUTLINE - NO LEAD 4222124/A 06/2015 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 4 5 8 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 C THERMAL PAD EXPOSED NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 5.500 SCALE 30.000 SECTION A-A SECTION A-A OPTIONAL TERMINAL TYPICAL TYPICAL LM27761 www.ti.com SNVSA85 – OCTOBER 2015 Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM27761 |
类似零件编号 - LM27761_15 |
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类似说明 - LM27761_15 |
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