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MCRF451 数据表(PDF) 8 Page - Microchip Technology |
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MCRF451 数据表(HTML) 8 Page - Microchip Technology |
8 / 50 page MCRF450/451/452/455 DS40232H-page 8 2003 Microchip Technology Inc. FIGURE 2-1: MCRF450/451/452/455 DIE LAYOUT F CLK Ant. A Ant. B CLK Vss 1590.6 865.2 1037.6 1071.5 900.1 1613 X Y Top View Die size before saw: Bond pad size: (Notch edge of wafer) 1.904 mm x 2.3408 mm 74.96 mil x 92.16 mil 0.089 mm x 0.089 mm 3.5 mil x 3.5 mil V DD Die size after saw: 1.8405 mm x 2.2773 mm 72.46 mil x 89.66 mil Bumped die: Bump Height: 25 µm ±3 µm Bump Size: 103 µm x 103 µm (Covered all passivation opening of bond pad) Other area except the four bumped pads: Covered by Polyamide 1904.0 µm x 2340.8 µm 1840.5 µm x 2277.3 µm 89 µm x 89 µm Bumped Pad: Four corner pads (F CLK, VSS, Antenna B, Antenna A) Bumping Material: 99.6% Gold Thickness of Polyamide: 3 µm Note: Coordinate units are in µm. See Table 2-5 for die mechanical dimensions. |
类似零件编号 - MCRF451 |
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类似说明 - MCRF451 |
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