DAC5681

www.ti.com

SLLS864C – AUGUST 2007 – REVISED AUGUST 2012

16-BIT, 1.0 GSPS Digital-to-Analog Converter (DAC)

Check for Samples: DAC5681

1

FEATURES

DESCRIPTION

The DAC5681 is a 16-bit 1.0 GSPS digital-to-analog

•

16-Bit Digital-to-Analog Converter (DAC)

converter (DAC) with wideband LVDS data input and

•

1.0 GSPS Update Rate

internal voltage reference. The DAC5681 offers

•

16-Bit Wideband Input LVDS Data Bus

superior linearity and noise performance.

–

8 Sample Input FIFO

The DAC5681 integrates a wideband LVDS port with

–

On-Chip Delay Lock Loop

on-chip termination, providing full 1.0 GSPS data

transfer into the DAC and lower EMI than traditional

•

High Performance

CMOS data interfaces. An on-chip delay lock loop

–

73 dBc ACLR WCDMA TM1 at 180 MHz

(DLL) simplifies LVDS interfacing by providing skew

•

On Chip 1.2 V Reference

control for the LVDS input data clock.

•

Differential Scalable Output: 2 to 20 mA

The current-steering architecture of the DAC5681

•

Package: 64-Pin 9 × 9 mm QFN

consists of a segmented array of current sinking

switches directing up to 20mA of full-scale current to

complementary output nodes. An accurate on-chip

APPLICATIONS

voltage reference is temperature-compensated and

•

Cellular Base Stations

delivers a stable 1.2-V reference voltage. Optionally,

•

Broadband Wireless Access (BWA)

an external reference may be used.

•

WiMAX 802.16

The DAC5681 is characterized for operation over the

•

Fixed Wireless Backhaul

industrial temperature range of –40°C to 85°C and is

available in a 64-pin QFN package. The device is pin

•

Cable Modem Termination System (CMTS)

upgradeable to the other members of the family: the

•

Medical / Test Instrumentation

DAC5681Z

and

DAC5682Z.

The

single-channel

•

Radar Systems

DAC5681Z

and

dual-channel

DAC5682Z

both

provide optional 2x/4x interpolation and a clock

multiplying PLL.

ORDERING INFORMATION

ORDER CODE

TRANSPORT MEDIA

QUANTITY

(3)

DAC5681IRGCT

Tape and Reel

250

RGC / 64QFN Quad Flatpack No-

–40°C to 85°C

Lead

DAC5681IRGCR

Tape and Reel

2000

(1)

Thermal Pad Size: 7,4 mm × 7,4 mm

(2)

MSL Peak Temperature: Level-3-260C-168 HR

(3)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2007–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.