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BCP55 数据表(PDF) 8 Page - NXP Semiconductors |
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BCP55 数据表(HTML) 8 Page - NXP Semiconductors |
8 / 22 page BCP55_BCX55_BC55PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 8 — 24 October 2011 8 of 22 NXP Semiconductors BCP55; BCX55; BC55PA 60 V, 1 A NPN medium power transistors FR4 PCB, mounting pad for collector 6 cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values FR4 PCB, standard footprint Fig 7. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values 006aac679 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 006aac680 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.5 0.75 |
类似零件编号 - BCP55_15 |
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类似说明 - BCP55_15 |
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