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TS2596 数据表(PDF) 4 Page - Taiwan Semiconductor Company, Ltd |
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TS2596 数据表(HTML) 4 Page - Taiwan Semiconductor Company, Ltd |
4 / 9 page TS2596 3A / 150KHz Buck Dc-Dc Converter 4/9 Version: E13 Typical Application Circuit (Continue) 2. Fixed Output Voltage Version C2 0.1uF D1 B340A L1 47uH 1 2 C3 470uF C1 470uF U1 1 2 3 4 5 Vcc SW FB EN Vss Vout=5.0V/3A VIN=24V C6 0.1uF L1 recommend value (IOUT=3A,) VOUT 2.5V 3.3V 5V 12V VIN=12V 33uH 33uH 33~47uH NA VIN=24V 33uH 33uH 47uH 68uH Pin Function Description Vcc This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be presented at this pin to minimize voltage transients and to supply the switching currents needed by the regulator. Ground Circuit ground SW Output Internal switch. The voltage at this pin switches between (+Vcc – Vsat) and approximately – 0.5V, with a duty cycle of approximately Vout / Vcc. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be minimized. Feedback Sense the regulated output voltage to complete the feedback loop. Enable Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply current to approximately 100uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a maximum of Vcc) shuts the regulator down. If this shutdown feature is not needed, the EN pin can be wired to the ground pin. Thermal Considerations The TS2596 is available in two packages, a TO-220-5L and TO-263-5L. The TO-220-5L package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage, the load current and the ambient temperature. The TS2596 junction temperature rises above ambient temperature for a 3A load and different input and output voltages. The data for these curves was taken with the TS2596 (TO-220-5L package) operating as a buck switching regulator in an ambient temperature of 25 o C (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking. The TO-263-5L surface mount package tab is designed to be soldered to the copper on a printed circuit board. The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.8 in 2 , and ideally should have 2 or more square inches of 2 oz. Additional copper area improves the thermal characteristics, |
类似零件编号 - TS2596_13 |
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类似说明 - TS2596_13 |
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