CYStech Electronics Corp.

Spec. No. : C975E3

Issued Date : 2014.07.10

Revised Date :

Page No. : 8/8

MTB050P10E3

CYStek Product Specification

TO-220 Dimension

*: Typical

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

A

4.400

4.600

0.173

0.181

e

2.540*

0.100*

A1

2.250

2.550

0.089

0.100

e1

4.980

5.180

0.196

0.204

b

0.710

0.910

0.028

0.036

F

2.650

2.950

0.104

0.116

b1

1.170

1.370

0.046

0.054

H

7.900

8.100

0.311

0.319

c

0.330

0.650

0.013

0.026

h

0.000

0.300

0.000

0.012

c1

1.200

1.400

0.047

0.055

L

12.900

13.400

0.508

0.528

D

9.910

10.250

0.390

0.404

L1

2.850

3.250

0.112

0.128

E

8.950

9.750

0.352

0.384

V

7/500 REF

0.295 REF

E1

12.650

12.950

0.498

0.510

Φ

3.400

3.800

0.134

0.150

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

 Lead: Pure tin plated.

 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

 CYStek reserves the right to make changes to its products without notice.

 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

Style: Pin 1.Gate 2.Drain 3.Source

4.Drain

3-Lead TO-220 Plastic Package

CYStek Package Code: E3

Device Name

Date Code

1 2 3

4

B050

P10

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