AD8133

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12 V

Power Dissipation

See Figure 3

Input Common-Mode Voltage

Storage Temperature

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature Range

(Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress rat-

ing only and functional operation of the device at these or any

other conditions above those indicated in the operational sec-

tion of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for the device soldered in a circuit board in still air.

Table 4. Thermal Resistance with the Underside Pad

Connected to the Plane

Package Type/PCB Type

Unit

24-Lead LFCSP/4-Layer

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8133 package is

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit may change the stresses that

the package exerts on the die, permanently shifting the para-

metric performance of the AD8133. Exceeding a junction tem-

perature of 175°C for an extended period of time can result in

changes in the silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

and common-mode currents flowing to the loads, as well as

currents flowing through the internal differential and common-

mode feedback loops. The internal resistor tap used in the

common-mode feedback loop places a 4 kΩ differential load on

the output. RMS output voltages should be considered when

dealing with ac signals.

the package leads from metal traces, through holes, ground,

underside of the package must be soldered to a pad on the PCB

surface that is thermally connected to a copper plane in order to

Figure 3 shows the maximum safe power dissipation in the

package versus ambient temperature for the 24-lead LFCSP

(70°C/W) package on a JEDEC standard 4-layer board with the

underside paddle soldered to a pad that is thermally connected

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–40

–20

0

20

40

60

80

AMBIENT TEMPERATURE (

°C)

LFCSP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.