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HCPL-5300 数据表(PDF) 4 Page - Agilent(Hewlett-Packard)

部件名 HCPL-5300
功能描述  Intelligent Power Module and Gate Drive Interface Optocouplers
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制造商  HP [Agilent(Hewlett-Packard)]
网页  http://www.home.agilent.com
标志 HP - Agilent(Hewlett-Packard)

HCPL-5300 数据表(HTML) 4 Page - Agilent(Hewlett-Packard)

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Insulation and Safety Related Specifications
8-Pin DIP
Widebody
(300 Mil)
SO-8
(400 Mil)
Parameter
Symbol
Value
Value
Value
Units
Conditions
Minimum External
L(101)
7.1
4.9
9.6
mm
Measured from input terminals
Air Gap (External
to output terminals, shortest
Clearance)
distance through air.
Minimum External
L(102)
7.4
4.8
10.0
mm
Measured from input terminals
Tracking (External
to output terminals, shortest
Creepage)
distance path along body.
Minimum Internal
0.08
0.08
1.0
mm
Through insulation distance,
Plastic Gap
conductor to conductor, usually
(Internal Clearance)
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
NA
NA
4.0
mm
Measured from input terminals
Tracking (Internal
to output terminals, along
Creepage)
internal cavity.
Tracking Resistance
CTI
200
200
200
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
Regulatory Information
The devices contained in this data
sheet have been approved by the
following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92 (HCNW4506 and
HCPL-4506 Option 060 only).
BSI
Certification according to
BS451:1994
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW4506 only).
Note: Use of nonchlorine activated fluxes is recommended.
240
∆T = 115°C, 0.3°C/SEC
0
∆T = 100°C, 1.5°C/SEC
∆T = 145°C, 1°C/SEC
TIME – MINUTES
220
200
180
160
140
120
100
80
60
40
20
0
260
12
3
456789
10
11
12
Solder Reflow Temperature Profile


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