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LM3410 数据表(PDF) 3 Page - Texas Instruments |
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LM3410 数据表(HTML) 3 Page - Texas Instruments |
3 / 44 page LM3410 www.ti.com SNVS541F – OCTOBER 2007 – REVISED AUGUST 2010 Table 1. Pin Descriptions - 5-Pin SOT23 Pin Name Function 1 SW Output switch. Connect to the inductor, output diode. 2 GND Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin. 3 FB Feedback pin. Connect FB to external resistor divider to set output voltage. Dimming & shutdown control input. Logic high enables operation. Duty Cycle from 0 to 100%. Do not allow this pin to 4 DIM float or be greater than VIN + 0.3V. 5 VIN Supply voltage pin for power stage, and input supply voltage. Table 2. Pin Descriptions - 6-Pin LLP Pin Name Function 1 PGND Power ground pin. Place PGND and output capacitor GND close together. 2 VIN Supply voltage for power stage, and input supply voltage. Dimming & shutdown control input. Logic high enables operation. Duty Cycle from 0 to 100%. Do not allow this pin to 3 DIM float or be greater than VIN + 0.3V. 4 FB Feedback pin. Connect FB to external resistor divider to set output voltage. 5 AGND Signal ground pin. Place the bottom resistor of the feedback network as close as possible to this pin & pin 4. 6 SW Output switch. Connect to the inductor, output diode. DAP GND Signal & Power ground. Connect to pin 1 & pin 5 on top layer. Place 4-6 vias from DAP to bottom layer GND plane. Table 3. Pin Descriptions - 8-Pin eMSOP Pin Name Function 1 - No Connect 2 PGND Power ground pin. Place PGND and output capacitor GND close together. 3 VIN Supply voltage for power stage, and input supply voltage. Dimming & shutdown control input. Logic high enables operation. Duty Cycle from 0 to 100%. Do not allow this pin to 4 DIM float or be greater than VIN + 0.3V. 5 FB Feedback pin. Connect FB to external resistor divider to set output voltage. 6 AGND Signal ground pin. Place the bottom resistor of the feedback network as close as possible to this pin & pin 5 7 SW Output switch. Connect to the inductor, output diode. 8 - No Connect DAP GND Signal & Power ground. Connect to pin 2 & pin 6 on top layer. Place 4-6 vias from DAP to bottom layer GND plane. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) VIN -0.5V to 7V SW Voltage -0.5V to 26.5V FB Voltage -0.5V to 3.0V DIM Voltage -0.5V to 7.0V ESD Susceptibility (2) Human Body Model 2kV Junction Temperature (3) 150°C Storage Temp. Range -65°C to 150°C Soldering Information Infrared/Convection Reflow (15sec) 220°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics. (2) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. Test method is per JESD22-A114. (3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device. Copyright © 2007–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3410 |
类似零件编号 - LM3410_14 |
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类似说明 - LM3410_14 |
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