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LM3554 数据表(PDF) 3 Page - Texas Instruments |
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LM3554 数据表(HTML) 3 Page - Texas Instruments |
3 / 43 page A1 A2 B1 B2 B3 Top View A3 C2 C1 C3 D2 D3 A4 B4 C4 D4 D1 LM3554 www.ti.com SNVS549A – JUNE 2009 – REVISED APRIL 2011 Connection Diagram Pin Functions Pin Descriptions Pin Name Function A1 LED1 High-Side Current Source Output for Flash LED. A2, B2 OUT Step-Up DC/DC Converter Output. A3, B3 SW Drain Connection for Internal NMOS and Synchronous PMOS Switches. A4, B4 GND Ground B1 LED2 High-Side Current Source Output for Flash LED. LEDI/NTC Configurable as a High-Side Current Source Output for Indicator LED or Threshold Detector for LED C1 Temperature Sensing. TX1/TORCH/GPIO Configurable as a RF Power Amplifier Synchronization Control Input (TX1), a Hardware Torch C2 1 Enable (TORCH), or a programmable general-purpose logic Input/Output (GPIO1). C3 STROBE Active High Hardware Flash Enable. Drive STROBE high to turn on Flash pulse. C4 IN Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a minimum 4.7µF ceramic capacitor. D1 ENVM/TX2/GPIO2 Configurable as an Active High Voltage Mode Enable (ENVM), Dual Polarity Power Amplifier /INT Synchronization Input (TX2), or Programmable General Purpose Logic Input/Output (GPIO2). D2 SDA Serial Data Input/Output. D3 SCL Serial Clock Input. D4 HWEN Active Low Hardware Reset. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN, VSW, VOUT -0.3V to 6V VSCL, VSDA, VHWEN, VSTROBE, VTX1/TORCH, VENVM/TX2, VLED1, VLED2, VLEDI/NTC -0.3V to to (VIN+0.3V) w/ 6.0V max Continuous Power Dissipation(3) Internally Limited Junction Temperature (TJ-MAX) +150°C Storage Temperature Range -65°C to +150°C Maximum Lead Temperature (Soldering) (4) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table. (2) All voltages are with respect to the potential at the GND pin. (3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and disengages at TJ=135°C (typ.). (4) For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level chip Scale Package (AN-1112) Copyright © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3554 |
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类似说明 - LM3554 |
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