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LM3554 数据表(PDF) 3 Page - Texas Instruments

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部件名 LM3554
功能描述  Synchronous Boost Converter with 1.2A Dual High Side LED Drivers and I2C Compatible
Download  43 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

LM3554 数据表(HTML) 3 Page - Texas Instruments

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A1
A2
B1
B2
B3
Top View
A3
C2
C1
C3
D2
D3
A4
B4
C4
D4
D1
LM3554
www.ti.com
SNVS549A – JUNE 2009 – REVISED APRIL 2011
Connection Diagram
Pin Functions
Pin Descriptions
Pin
Name
Function
A1
LED1
High-Side Current Source Output for Flash LED.
A2, B2
OUT
Step-Up DC/DC Converter Output.
A3, B3
SW
Drain Connection for Internal NMOS and Synchronous PMOS Switches.
A4, B4
GND
Ground
B1
LED2
High-Side Current Source Output for Flash LED.
LEDI/NTC
Configurable as a High-Side Current Source Output for Indicator LED or Threshold Detector for LED
C1
Temperature Sensing.
TX1/TORCH/GPIO Configurable as a RF Power Amplifier Synchronization Control Input (TX1), a Hardware Torch
C2
1
Enable (TORCH), or a programmable general-purpose logic Input/Output (GPIO1).
C3
STROBE
Active High Hardware Flash Enable. Drive STROBE high to turn on Flash pulse.
C4
IN
Input Voltage Connection. Connect IN to the input supply, and bypass to GND with a minimum
4.7µF ceramic capacitor.
D1
ENVM/TX2/GPIO2 Configurable as an Active High Voltage Mode Enable (ENVM), Dual Polarity Power Amplifier
/INT
Synchronization Input (TX2), or Programmable General Purpose Logic Input/Output (GPIO2).
D2
SDA
Serial Data Input/Output.
D3
SCL
Serial Clock Input.
D4
HWEN
Active Low Hardware Reset.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
VIN, VSW, VOUT
-0.3V to 6V
VSCL, VSDA, VHWEN, VSTROBE, VTX1/TORCH, VENVM/TX2, VLED1, VLED2, VLEDI/NTC
-0.3V to to (VIN+0.3V) w/ 6.0V max
Continuous Power Dissipation(3)
Internally Limited
Junction Temperature (TJ-MAX)
+150°C
Storage Temperature Range
-65°C to +150°C
Maximum Lead Temperature (Soldering)
(4)
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics table.
(2)
All voltages are with respect to the potential at the GND pin.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and
disengages at TJ=135°C (typ.).
(4)
For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer
Level chip Scale Package (AN-1112)
Copyright © 2009–2011, Texas Instruments Incorporated
Submit Documentation Feedback
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