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U0603R103KCT 数据表(PDF) 10 Page - List of Unclassifed Manufacturers |
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U0603R103KCT 数据表(HTML) 10 Page - List of Unclassifed Manufacturers |
10 / 19 page Nickel Barrier Multilayer Ceramic Capacitors Page 10 27/04/06 V1.0 Component Layout When placing / mounting the capacitors / components near an area which is apt to bend or a grid groove on the PC board. It is advisable to have both electrodes subjected to uniform stresses, or to position the component electrodes at right angles to the grid groove or bending line. Figure 3 Component Layout Uneven mounting density O: Proper X: Improper Probability at which the chip capacitor is broken by the stress on PC board break A > B = C >D > E Mounting Density and Spaces Placements in too narrow spaces between components may cause “ Solder Bridges” during soldering. The minimum space between components shall be 0.5mm in view of the positioning tolerances of the mounting machines and the dimensional tolerances of the components and PC boards. Applications of Solder Resist Application of Solder Resist are effective to prevent solder bridges and to control amounts of solder on PC boards ( As shown in Table 2). Recommended Application Examples Examples of Solder Bridges Narrow Spacing between Chip Components Radial Components are directly connected to Chip Components Common lands are close to Chip Components |
类似零件编号 - U0603R103KCT |
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