XYTT

GXX

Bump A1

LM4947, LM4947TLEVAL

SNAS349C – JUNE 2006 – REVISED NOVEMBER 2007

www.ti.com

NOTE: XY - Date Code: TT - Die Traceability: G - Boomer Family: XX - H1

Figure 4. micro SMD Marking - Top View

Table 2. Pin Descriptions

Bump

Name

Description

A1

Right Input Channel 2 or Right Differential Input –

A2

Left Input Channel 1 or Left Differential Input +

A3

MIN+

Mono Channel Non-inverting Input

A4

Right Headphone 3D Input 1

A5

Right Headphone 3D Input 2

B1

Right Input Channel 1 or Right Differential Input +

B2

Left Input Channel 2 or Left Differential Input–

B3

MIN-

Mono Channel Inverting Input

B4

Left Headphone 3D Input 2

B5

Left Headphone 3D Input 1

C1

ADDR

Address Identification

C2

SDA

Serial Data Input

C3

SCL

Serial Clock Input

C4

Half-Supply Bypass Capacitor

C5

VOC

Headphone return bias output

D1

Analog Power Supply

D2

Loudspeaker Power Supply

D3

I2C Interface Power Supply

D4

Analog Power Supply

D5

Right Headphone Output

E1

LS-

Loudspeaker Output Negative

E2

GND

Ground

E3

LS+

Loudspeaker Output Positive

E4

GND

Ground

E5

Left Headphone Output

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

4

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