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AD222-00 数据表(PDF) 2 Page - List of Unclassifed Manufacturers |
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AD222-00 数据表(HTML) 2 Page - List of Unclassifed Manufacturers |
2 / 12 page Appendix - 132 - www.nve.com phone: 952-829-9217 fax: 952-829-9189 ackage Drawing – TDFN6 2.5 mm x 2.5 mm P 2.00 ± 0.05 C0.10 PIN 1 ID 0.30 ± 0.05(6x) 0.30 ± 0.05(6x) 0.65 TYP. (4x) 1.30 REF (2X) 1 3 1 3 6 4 4 PIN 1 INDEX AREA 2.50 ± 0.10 6 0.0-0.05 0.80 MAX 0.20 REF. Note: Dimensions in mm. TDFN6 package has thermal power dissipation of 320°C/Watt in free air. ackage Drawing – TDFN SO8 Attaching the package to a circuit board improves thermal performance. P 5 4 5 1 5 8 1 PIN 1 INDEX AREA 4.900 ± 0.20 4 0.0-0.05 0.75±0.05 0.75±0.05 MAX Pin 1 ID 3.90 ± 0.15 0.65 ± 0.10 (8x) 1.27 Typ. (6x) 3.81REF (2x) 0.40 ± 0.05 (8x) Note: Dimensions in mm. TDFN SO8 Package has thermal power dissipation of 240°C/Watt in free air. Attaching the package to a circuit board improves thermal performance. |
类似零件编号 - AD222-00 |
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类似说明 - AD222-00 |
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