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SD3114-221-R 数据表(PDF) 1 Page - Cooper Bussmann, Inc. |
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SD3114-221-R 数据表(HTML) 1 Page - Cooper Bussmann, Inc. |
1 / 3 page Description • 125°C maximum total temperature operation • 3.1mm x 3.1mm x 1.4mm shielded drum core • Ferrite core material • Inductance range from 1.0uH to 330uH • Current range from 2.59 Amps to 0.106 Amps • Frequency range up to 4MHz Applications • Cellular phones, Digital cameras, CD players, PDA’s • Small LCD displays • LED driver and LED flash circuits • Hard disk drives • Backlighting • EL panel Environmental Data • Storage temperature range: -40°C to +125°C • Operating temperature range: -40°C to +125°C (range is application specific) • Solder reflow temperature: +260°C max. for 10 seconds maximum Packaging • Supplied in tape and reel packaging, 4100 per reel SD3114 Series Low Profile Power Inductors Part Number Rated OCL (1) Part Irms (2) Isat (3) DCR ( Ω) K-factor Inductance (µH) Marking Amperes Amperes typ. @ (4) (µH) Designator 20°C SD3114-1R0-R 1.0 1.16+/-30% A 1.60 2.35 0.058 98 SD3114-1R5-R 1.5 1.44+/-30% B 1.39 2.11 0.077 79 SD3114-2R2-R 2.2 2.12+/-30% C 1.17 1.74 0.110 67 SD3114-3R3-R 3.3 3.36+/-30% D 0.95 1.38 0.167 54 SD3114-4R7-R 4.7 4.90+/-30% E 0.77 1.14 0.251 45 SD3114-6R8-R 6.8 6.72+/-30% F 0.71 0.98 0.296 37 SD3114-8R2-R 8.2 8.10+/-30% G 0.68 0.89 0.329 34 SD3114-100-R 10.0 10.4+/-30% H 0.57 0.78 0.458 30 SD3114-150-R 15.0 14.9+/-20% I 0.48 0.66 0.650 25 SD3114-220-R 22.0 22.5+/-20% J 0.43 0.53 0.821 21 SD3114-330-R 33.0 33.1+/-20% K 0.35 0.44 1.23 17 SD3114-470-R 47.0 47.5+/-20% L 0.280 0.37 1.86 14 SD3114-680-R 68.0 68.6+/-20% M 0.239 0.305 2.62 12 SD3114-820-R 82.0 81.8+/-20% N 0.227 0.280 2.91 11 SD3114-101-R 100.0 101.1+/-20% O 0.213 0.252 3.30 10 SD3114-151-R 150.0 149.0+/-20% P 0.172 0.207 5.07 8 SD3114-221-R 220.0 220.9+/-20% Q 0.140 0.170 7.67 6 SD3114-331-R 330.0 329.5+/-20% R 0.113 0.139 11.78 5 (1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc. (2) Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 30% rolloff (@20°C) (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L* ∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps). RoHS 2002/95/EC |
类似零件编号 - SD3114-221-R |
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类似说明 - SD3114-221-R |
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