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SI-8001FDE 数据表(PDF) 5 Page - Sanken electric |
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SI-8001FDE 数据表(HTML) 5 Page - Sanken electric |
5 / 9 page 5 SANKEN ELECTRIC CO., LTD. DC-to-DC Step-Down Converter SI-8001FDE 27469.056 Thermal Performance Characteristics 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 –25 0 25 50 75 100 125 Power Dissipation versus Ambient Temperature T J(max) = 125°C; Mounted on glass-epoxy PCB (40 mm × 40 mm), with varying exposed copper areas TA (°C) Cu Area: 1600 mm2 RθJA = 33.3°C/W Cu Area: 800 mm2 RθJA = 37°C/W Cu Area: 400 mm2 RθJA = 44°C/W Cu Area: 100 mm2 RθJA = 53°C/W Device Thermal Resistance versus Exposed Copper Area on PCB Glass-epoxy PCB, 40 mm × 40 mm Copper Area (mm2) 55 50 45 40 35 30 0 800 1000 1200 1400 1600 200 400 600 1800 6 5 4 3 2 1 0 0 20 40 60 80 100 120 140 180 160 TJ (°C) Overtemperature Protection: Output Voltage versus Junction Temperature V IN = 15 V, IO = 10 mA OTP On OTP Off The application must be designed to ensure that the TJ(max) of the device is not exceeded during operation. To do so, it is necessary to determine values for maximum power dissipation, PD(max), and ambient temperature, TA(max). The relationships of TJ, PD, TA, and case temperature, TC, are as shown in the following formulas: TJ – TC RθJC PD = TJ – TA RθJA PD = and . PD can be calculated from input values: ⎟⎟ ⎠ ⎞ ⎜⎜ ⎝ ⎛ − ⋅ − ⎟⎟ ⎠ ⎞ ⎜⎜ ⎝ ⎛ − ⋅ = IN O O F x O O D V V I V I V P 1 1 100 where: VO is output voltage in V, VIN is input supply voltage in V, IO is output current in A, ηx is IC efficiency in percent (varies with VIN and IO; refer to efficiency performance curves for value), and VF is forward voltage for the input diode, Di. In these tests, the Sanken SPB-G56S was used, at 0.4 V. For application design, obtain thermal data from the datasheet for the diode. PD is substantially affected by the heat conductance properties of the application, in particular any exposed copper area on the PCB where the device is mounted. The relationships of PD, TA, and copper area is represented in the Power Dissipation chart. RθJA for a given copper area can be determined form the Device Thermal Resistance chart. This can be substituted into the formula above to determine the TJ (max) allowable in the application. Generally, more than 10% to 20% derating is required. Because the heat dissipation capacity of the copper area depends substantively on how it is used in the actual application, thermal characteristics of the application must be confirmed by testing. TC is determined by connecting a thermocouple to the device as shown here: Thermocouple mount at tab center And analyzing the results using the following formula: TJ = PD × RθJC + TC , for this device, RθJC is 3 °C/W. |
类似零件编号 - SI-8001FDE |
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类似说明 - SI-8001FDE |
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