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DAC714P 数据表(PDF) 8 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation. Click here to check the latest version.
部件名 DAC714P
功能描述  16-Bit DIGITAL-TO-ANALOG CONVERTER With Serial Data Interface
Download  14 Pages
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制造商  BURR-BROWN [Burr-Brown (TI)]
网页  http://www.burr-brown.com
标志 BURR-BROWN - Burr-Brown (TI)

DAC714P 数据表(HTML) 8 Page - Burr-Brown (TI)

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®
DAC714
DAC714 CALIBRATION VALUES
DIGITAL INPUT CODE
ANALOG OUTPUT (V)
BINARY TWO’S
BIPOLAR
UNIPOLAR
COMPLEMENT, BTC
20V RANGE
10V RANGE
DESCRIPTION
7FFFH
+9.999695
+9.999847
+ Full Scale –1LSB
|
4000H
+5.000000
+7.500000
3/4 Scale
|
0001H
+0.000305
+5.000153
BPZ + 1LSB
0000H
0.000000
+5.000000
Bipolar Zero (BPZ)
FFFFH
–0.000305
+4.999847
BPZ – 1LSB
|
C000H
–5.000000
+2.500000
1/4 Scale
|
8000H
–10.00000
0.000000
Minus Full Scale
critical settling time may be able to use 0.01
µF at –V
CC
as well as at +VCC. The capacitors should be located
close to the package.
The DAC714 has separate ANALOG COMMON and DIGI-
TAL COMMON pins. The current through DCOM is mostly
switching transients and are up to 1mA peak in amplitude.
The current through ACOM is typically 5
µA for all codes.
Use separate analog and digital ground planes with a single
interconnection point to minimize ground loops. The analog
pins are located adjacent to each other to help isolate analog
from digital signals. Analog signals should be routed as far
as possible from digital signals and should cross them at
right angles. A solid analog ground plane around the D/A
package, as well as under it in the vicinity of the analog and
power supply pins, will isolate the D/A from switching
currents. It is recommended that DCOM and ACOM be
connected directly to the ground planes under the package.
If several DAC714s are used or if DAC714 shares supplies
with other components, connecting the ACOM and DCOM
lines to together once at the power supplies rather than at
each chip may give better results.
LOAD CONNECTIONS
Since the reference point for VOUT and VREF OUT is the
ACOM pin, it is important to connect the D/A converter load
directly to the ACOM pin. Refer to Figure 5.
Lead and contact resistances are represented by R1 through
R3. As long as the load resistance RL is constant, R1 simply
introduces a gain error and can be removed by gain adjust-
ment of the D/A or system-wide gain calibration. R2 is part
of RL if the output voltage is sensed at ACOM.
In some applications it is impractical to return the load to the
ACOM pin of the D/A converter. Sensing the output voltage
at the SYSTEM GROUND point is reasonable, because there
is no change in DAC714 ACOM current, provided that R3 is
a low-resistance ground plane or conductor. In this case you
may wish to connect DCOM to SYSTEM GROUND as well.
FIGURE 4. Power Supply Connections.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1µF
1µF
DAC714
DCOM
+V
CC
ACOM
–V
CC
+12V to +15V
–12V to –15V
+
+
TABLE I. Digital Input and Analog Output Voltage Calibra-
tion Values.
Gain Adjustment
Apply the digital input that gives the maximum positive
voltage output. Adjust the gain potentiometer or the gain
adjust D/A converter for this positive full scale voltage.
INSTALLATION
GENERAL CONSIDERATIONS
Due to the high-accuracy of the DAC714 system design
problems such as grounding and contact resistance become
very important. A 16-bit converter with a 20V full-scale
range has a 1LSB value of 305
µV. With a load current of
5mA, series wiring and connector resistance of only 60m
will cause a voltage drop of 300
µV. To understand what this
means in terms of a system layout, the resistivity of a typical
1 ounce copper-clad printed circuit board is 1/2 m
Ω per
square. For a 5mA load, a 10 milliinch wide printed circuit
conductor 60 milliinches long will result in a voltage drop of
150
µV.
The analog output of DAC714 has an LSB size of 305
µV
(–96dB) in the bipolar mode. The rms noise floor of the D/A
should remain below this level in the frequency range of
interest. The DAC714’s output noise spectral density (which
includes the noise contributed by the internal reference,) is
shown in the Typical Performance Curves section.
Wiring to high-resolution D/A converters should be routed
to provide optimum isolation from sources of RFI and EMI.
The key to elimination of RF radiation or pickup is small
loop area. Signal leads and their return conductors should be
kept close together such that they present a small capture
cross-section for any external field. Wire-wrap construction
is not recommended.
POWER SUPPLY AND
REFERENCE CONNECTIONS
Power supply decoupling capacitors should be added as
shown in Figure 4. Best performance occurs using a 1 to
10
µF tantalum capacitor at –V
CC. Applications with less


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