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TPPM0302DGN 数据表(PDF) 10 Page - Texas Instruments |
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TPPM0302DGN 数据表(HTML) 10 Page - Texas Instruments |
10 / 16 page TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors (die area, number of thermal vias, thickness of copper) Consult the PowerPAD Thermally Enhanced Package Technical Brief. single-layer PCB Package Outline Use as Much Copper Area as Possible for Heat Spread Package Thermal Pad Figure 15. Land Configuration for Single-layer PCB Layout recommendations for a single-layer PCB utilize as much copper area as possible for power management. In a single layer board application, the thermal pad is attached to a heat spreader (copper area) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above, it is advisable to use as many copper traces as possible to dissipate the heat. IMPORTANT If the attachment method is NOT implemented correctly, the functionality of the product is not efficient. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. 8 TPPM0302 1 5VAUX NC 7 2 5VCC GND 0.1 µF 0.1 µF 4.7 µF 6 3 3.3VOUT NC 4.7 µF 5 4 3.3VAUX POK 0.1 µF 4.7 µF 4.7 µF 3.3VOUT 5 k Ω Figure 16. Typical Application Schematic |
类似零件编号 - TPPM0302DGN |
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类似说明 - TPPM0302DGN |
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