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AD8602ARZ-REEL 数据表(PDF) 5 Page - Analog Devices |
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AD8602ARZ-REEL 数据表(HTML) 5 Page - Analog Devices |
5 / 24 page AD8601/AD8602/AD8604 Rev. G | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating Supply Voltage 6 V Input Voltage GND to VS Differential Input Voltage ±6 V Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C Lead Temperature Range (Soldering, 60 sec) 300°C ESD 2 kV HBM θJA is specified for worst-case conditions, that is, a device soldered onto a circuit board for surface-mount packages using a standard 4-layer board. Table 4. Thermal Resistance Package Type θJA θJC Unit 5-Lead SOT-23 (RJ) 190 92 °C/W 8-Lead SOIC (R) 120 45 °C/W 8-Lead MSOP (RM) 142 45 °C/W 14-Lead SOIC (R) 115 36 °C/W 14-Lead TSSOP (RU) 112 35 °C/W 16-Lead QSOP (RQ) 115 36 °C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
类似零件编号 - AD8602ARZ-REEL |
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类似说明 - AD8602ARZ-REEL |
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