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HCPL-2400-500E 数据表(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-2400-500E 数据表(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
5 / 15 page 5 Regulatory Information The HCPL-24XX has been approved by the following organizations: Solder Reflow Thermal Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160°C 140°C 150°C PEAK TEMP. 245°C PEAK TEMP. 240°C PEAK TEMP. 230°C SOLDERING TIME 200°C PREHEATING TIME 150°C, 90 + 30 SEC. 2.5°C ± 0.5°C/SEC. 3°C + 1°C/–0.5°C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3°C + 1°C/–0.5°C/SEC. REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. Recommended Pb-Free IR Profile 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 20-40 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C Note: Non-halide flux should be used. Note: Non-halide flux should be used. VDE Approved according to VDE 0884/06.92 (Option 060 only). UL Recognized under UL 1577, Component Recognition Program, File E55361. IEC/EN/DIN EN 60747-5-2 Approved under: IEC 60747-5-2:1997 + A1:2002 EN 60747-5-2:2001 + A1:2002 DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01. (Option 060 only) |
类似零件编号 - HCPL-2400-500E |
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类似说明 - HCPL-2400-500E |
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