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LM117KSTEEL 数据表(PDF) 6 Page - Texas Instruments |
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LM117KSTEEL 数据表(HTML) 6 Page - Texas Instruments |
6 / 40 page LM117, LM317A, LM317-N SNVS774O – MAY 2004 – REVISED JANUARY 2014 www.ti.com LM317A and LM317-N ELECTRICAL CHARACTERISTICS (1) Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA. LM317A LM317-N Parameter Conditions Unit Min Typ Max Min Typ Max s 1.238 1.250 1.262 - 1.25 - V Reference Voltage 3V ≤ (VIN − VOUT) ≤ 40V, 1.225 1.250 1.270 1.20 1.25 1.30 V 10 mA ≤ IOUT ≤ IMAX (1) 0.005 0.01 0.01 0.04 Line Regulation 3V ≤ (VIN − VOUT) ≤ 40V (2) %/V 0.01 0.02 0.02 0.07 0.1 0.5 0.1 0.5 Load Regulation 10 mA ≤ IOUT ≤ IMAX (1) (2) % 0.3 1 0.3 1.5 Thermal Regulation 20 ms Pulse 0.04 0.07 0.04 0.07 %/W Adjustment Pin Current 50 100 50 100 μA Adjustment Pin Current 10 mA ≤ IOUT ≤ IMAX (1) 0.2 5 0.2 5 μA Change 3V ≤ (VIN − VOUT) ≤ 40V Temperature Stability TMIN ≤ TJ ≤ TMAX 1 1 % Minimum Load Current (VIN − VOUT) = 40V 3.5 10 3.5 10 mA NDS, KTT Packages - - - 1.5 2.2 3.4 (VIN − VOUT) ≤ 15V DCY, NDE Packages 1.5 2.2 3.4 1.5 2.2 3.4 A NDT Package 0.5 0.8 1.8 0.5 0.8 1.8 Current Limit NDS, KTT Packages - - 0.15 0.40 (VIN − VOUT) = 40V DCY, NDE Packages 0.15 0.40 0.15 0.40 A NDT Package 0.075 0.20 0.075 0.20 RMS Output Noise, % of 10 Hz ≤ f ≤ 10 kHz 0.003 0.003 % VOUT VOUT = 10V, f = 120 Hz, CADJ = 0 μF 65 65 dB Ripple Rejection Ratio VOUT = 10V, f = 120 Hz, CADJ = 10 μF 66 80 66 80 dB Long-Term Stability TJ = 125°C, 1000 hrs 0.3 1 0.3 1 % NDS (TO-3) Package - 2 NDE (TO-220) Package 4 4 KTT (TO-263) Package - 4 Thermal Resistance, θJC °C/W Junction-to-Case DCY (SOT-223) Package 23.5 23.5 NDT (TO) Package 21 21 NDP (TO-252) Package 12 12 - 39 NDS (TO-3) Package 50 50 NDE (TO-220) Package Thermal Resistance, θJA KTT (TO-263) Package (3) - 50 Junction-to-Ambient °C/W DCY (SOT-223) Package (3) 140 140 (No Heat Sink) NDT (TO) Package 186 186 NDP (TO-252) Package (3) 103 103 (1) IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL). (2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation. (3) When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PC board copper area that is thermally connected to the package. See the APPLICATION HINTS section for heatsink techniques. 6 Submit Documentation Feedback Copyright © 2004–2014, Texas Instruments Incorporated Product Folder Links: LM117 LM317A LM317-N |
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类似说明 - LM117KSTEEL |
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