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BCP53-16 数据表(PDF) 6 Page - NXP Semiconductors |
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BCP53-16 数据表(HTML) 6 Page - NXP Semiconductors |
6 / 22 page BCP53_BCX53_BC53PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 19 October 2011 6 of 22 NXP Semiconductors BCP53; BCX53; BC53PA 80 V, 1 A PNP medium power transistors 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2. Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air BCP53 [1] -- 192 K/W [2] -- 125 K/W [3] -- 93 K/W BCX53 [1] -- 250 K/W [2] -- 132 K/W [3] -- 93 K/W BC53PA [1] -- 298 K/W [2] -- 151 K/W [3] -- 114 K/W [4] -- 154 K/W [5] -- 76 K/W Rth(j-sp) thermal resistance from junction to solder point BCP53 - - 16 K/W BCX53 - - 16 K/W BC53PA - - 20 K/W |
类似零件编号 - BCP53-16 |
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类似说明 - BCP53-16 |
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