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HLMP-CM35-X10DD 数据表(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CM35-X10DD 数据表(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 10 page Example of Wave Soldering Temperature Profile for TH LED Ammo Packs Drawing 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. A A 12.70±1.00 0.50±0.0394 20.50±1.00 0.807±0.039 18.00±0.50 0.7087±0.0197 9.125±0.625 0.3593±0.0246 12.70±0.30 0.50±0.0118 0.70±0.20 0.0276±0.0079 6.35±1.30 0.25±0.0512 ∅ 4.00±0.20TYP. 0.1575±0.008 CATHODE VIEW A-A Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff. |
类似零件编号 - HLMP-CM35-X10DD |
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类似说明 - HLMP-CM35-X10DD |
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