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LMZ31704RVQT 数据表(PDF) 4 Page - Texas Instruments

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部件名 LMZ31704RVQT
功能描述  4A SIMPLE SWITCHER짰 Power Module with 2.95V-17V Input and Current Sharing in QFN Package
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

LMZ31704RVQT 数据表(HTML) 4 Page - Texas Instruments

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LMZ31704
SLVSBV8A – JUNE 2013 – REVISED AUGUST 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Over –40°C to 85°C free-air temperature, PVIN = VIN = 12 V, VOUT = 1.8 V, IOUT = 4 A,
CIN = 0.1 µF + 2 x 22 µF ceramic + 100 µF bulk, COUT = 4 x 47 µF ceramic (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fCLK
Synchronization frequency
200
1200
kHz
VCLK-H
CLK High-Level
2.0
5.5
V
CLK Control
VCLK-L
CLK Low-Level
0.5
V
DCLK
CLK Duty Cycle
20
50
80
%
Thermal shutdown
175
°C
Thermal Shutdown
Thermal shutdown hysteresis
10
°C
Ceramic
44(6)
CIN
External input capacitance
µF
Non-ceramic
100(6)
Ceramic
47(7)
200
1500
µF
COUT
External output capacitance
Non-ceramic
220(7)
5000(8)
Equivalent series resistance (ESR)
35
m
(6)
A minimum of 44 µF of external ceramic capacitance is required across the input (VIN and PVIN connected) for proper operation. An
additional 100 µF of bulk capacitance is recommended. It is also recommended to place a 0.1 µF ceramic capacitor directly across the
PVIN and PGND pins of the device. Locate the input capacitance close to the device. When operating with split VIN and PVIN rails,
place 4.7µF of ceramic capacitance directly at the VIN pin. See Table 6 for more details.
(7)
The amount of required output capacitance varies depending on the output voltage (see Table 5 ). The amount of required capacitance
must include at least 1x 47µF ceramic capacitor. Locate the capacitance close to the device. Adding additional capacitance close to the
load improves the response of the regulator to load transients. See Table 5 and Table 6 more details.
(8)
When using both ceramic and non-ceramic output capacitors, the combined maximum must not exceed 5000 µF. It may be necessary to
increase the slow start time when turning on into the maximum capacitance. See the Slow Start (SS/TR) section for information on
adjusting the slow start time.
THERMAL INFORMATION
LMZ31704
THERMAL METRIC(1)
RVQ42
UNIT
42 PINS
θJA
Junction-to-ambient thermal resistance(2)
13.3
ψJT
Junction-to-top characterization parameter(3)
1.6
°C/W
ψJB
Junction-to-board characterization parameter(4)
5.3
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, literature
number SPRA953.
(2)
The junction-to-ambient thermal resistance,
θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with
2 oz. copper and natural convection cooling. Additional airflow reduces
θJA.
(3)
The junction-to-top characterization parameter,
ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter,
ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
4
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