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AD7858L 数据表(PDF) 6 Page - Analog Devices |
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AD7858L 数据表(HTML) 6 Page - Analog Devices |
6 / 32 page REV. B –6– AD7858/AD7858L ORDERING GUIDE Linearity Power Error Dissipation Package Model (LSB) 1 (mW) Options 2 AD7858AN ±1 20 N-24 AD7858BN ±1/2 20 N-24 AD7858LAN 3 ±1 6.85 N-24 AD7858LBN3 ±1 6.85 N-24 AD7858AR ±1 20 R-24 AD7858BR ±1/2 20 R-24 AD7858LAR3 ±1 6.85 R-24 AD7858LBR 3 ±1 6.85 R-24 AD7858LARS 3 ±1 6.85 RS-24 EVAL-AD7858CB4 EVAL-CONTROL BOARD 5 NOTES 1Linearity error here refers to integral linearity error. 2N = Plastic DIP; R = SOIC; RS = SSOP. 3L signifies the low-power version. 4This can be used as a stand-alone evaluation board or in conjunction with the EVAL- CONTROL BOARD for evaluation/demonstration purposes. 5This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators. ABSOLUTE MAXIMUM RATINGS 1 (TA = +25 °C unless otherwise noted) AVDD to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V DVDD to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V Analog Input Voltage to AGND . . . . –0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND . . . . –0.3 V to DVDD + 0.3 V Digital Output Voltage to DGND . . . –0.3 V to DVDD + 0.3 V REFIN/REFOUT to AGND . . . . . . . . . –0.3 V to AVDD + 0.3 V Input Current to Any Pin Except Supplies 2 . . . . . . . ±10 mA Operating Temperature Range Commercial (A, B Versions) . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 °C Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260 °C SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW θ JA Thermal Impedance . . . 75 °C/W (SOIC) 115°C/W (SSOP) θJC Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP) Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215 °C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220 °C NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up. PIN CONFIGURATIONS DIP, SOIC, AND SSOP 13 16 15 14 24 23 22 21 20 19 18 17 TOP VIEW (Not to Scale) 12 11 10 9 8 1 2 3 4 7 6 5 AD7858/ AD7858L CONVST DIN CLKIN SCLK SYNC BUSY SLEEP REFIN/REFOUT DVDD DGND DOUT AVDD AGND CREF1 CREF2 AIN1 AIN2 AIN7 AIN8 CAL AIN3 AIN4 AIN6 AIN5 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
类似零件编号 - AD7858L |
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类似说明 - AD7858L |
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