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SI6963DQ 数据表(PDF) 2 Page - Fairchild Semiconductor

部件名 SI6963DQ
功能描述  Dual P-Channel 2.5V Specified PowerTrench MOSFET
Download  5 Pages
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制造商  FAIRCHILD [Fairchild Semiconductor]
网页  http://www.fairchildsemi.com
标志 FAIRCHILD - Fairchild Semiconductor

SI6963DQ 数据表(HTML) 2 Page - Fairchild Semiconductor

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Si6963DQ Rev. A (W)
Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V, ID = –250
µA
–20
V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
ID = –250
µA, Referenced to 25°C
–16
mV/
°C
IDSS
Zero Gate Voltage Drain Current
VDS = –16 V,
VGS = 0 V
–1
µA
IGSSF
Gate–Body Leakage, Forward
VGS = –12 V,
VDS = 0 V
–100
nA
IGSSR
Gate–Body Leakage, Reverse
VGS = 12 V,
VDS = 0 V
100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS, ID = –250
µA
–0.6
–1.0
–1.5
V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
ID = –250
µA, Referenced to 25°C
3
mV/
°C
RDS(on)
Static Drain–Source
On–Resistance
VGS = –4.5 V,
ID = –3.8 A
VGS = –2.5 V,
ID = –3.0 A
VGS = –4.5 V, ID = –3.8 A, TJ=125
°C
0.036
0.056
0.049
0.043
0.070
0.069
ID(on)
On–State Drain Current
VGS = –4.5 V,
VDS = –5 V
–15
A
gFS
Forward Transconductance
VDS = –5 V,
ID = –3.8 A
13.2
S
Dynamic Characteristics
Ciss
Input Capacitance
1015
pF
Coss
Output Capacitance
446
pF
Crss
Reverse Transfer Capacitance
VDS = –10 V,
V GS = 0 V,
f = 1.0 MHz
118
pF
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
11
20
ns
tr
Turn–On Rise Time
18
32
ns
td(off)
Turn–Off Delay Time
34
55
ns
tf
Turn–Off Fall Time
VDD = –5 V,
ID = –1 A,
VGS = –4.5 V,
RGEN = 6
34
55
ns
Qg
Total Gate Charge
9.7
16
nC
Qgs
Gate–Source Charge
2.2
nC
Qgd
Gate–Drain Charge
VDS = –5 V,
ID = –3.8 A,
VGS = –4.5 V
2.4
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
–0.83
A
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = –0.83 A (Note 2)
–0.7
–1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a)
RθJA is 125 °C/W (steady state) when mounted on 1 inch² copper pad on FR-4.
b)
RθJA is 208 °C/W (steady state) when mounted on minimum copper pad on FR-4.
2. Pulse Test: Pulse Width < 300
µs, Duty Cycle < 2.0.


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