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TDA1519CTD 数据表(PDF) 2 Page - NXP Semiconductors

部件名 TDA1519CTD
功能描述  22 W BTL or 2 x 11 W stereo power amplifier
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

TDA1519CTD 数据表(HTML) 2 Page - NXP Semiconductors

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2004 Jan 28
2
NXP Semiconductors
Product specification
22 W BTL or 2
 11 W
stereo power amplifier
TDA1519C
FEATURES
 Requires very few external components for Bridge-Tied
Load (BTL) operation
 Stereo or BTL application
 High output power
 Low offset voltage at output (important for BTL
applications)
 Fixed gain
 Good ripple rejection
 Mute/standby switch
 Load dump protection
 AC and DC short-circuit safe to ground and V
P
 Thermally protected
 Reverse polarity safe
 Capability to handle high energy on outputs (V
P =0V)
 No switch-on/switch-off plops
 Protected against electrostatic discharge
 Low thermal resistance
 Identical inputs (inverting and non-inverting)
 Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
GENERAL DESCRIPTION
The TDA1519C is an integrated class-B dual output
amplifier in a 9-lead plastic single in-line power package or
20-lead heatsink small outline package.
For the TDA1519CTH (SOT418-3), the heatsink is
positioned on top of the package, which allows an external
heatsink to be mounted on top. The heatsink of the
TDA1519CTD (SOT397-1) is facing the PCB, allowing the
heatsink to be soldered onto the copper area of the PCB.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA1519C
SIL9P
plastic single in-line power package; 9 leads
SOT131-2
TDA1519CSP
SMS9P
plastic surface mounted single in-line power package; 9 leads
SOT354-1
TDA1519CTD
HSOP20
plastic, heatsink small outline package; 20 leads
SOT397-1
TDA1519CTH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3


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