■ Specifications are subject to change without notice. Specifications in this catalog are for reference. The formal specification sheets will be submitted upon request.

COPAL ELECTRONICS

■

SOLDERING CONDITIONS

When dip-soldering CS-4-13NA, NB or CS-4-22YA, YB, solder bridges may occur between terminals depending upon

soldering conditions.

In order to prevent such bridges,vertical flow direction is recommended as shown in the below figure.

For dip-soldering,preheating should be done after apply-ing flux.

Handle carefully in case of parallel flow direction in which solder bridges occur more often because solder flow moves toward

the vertical direction against the terminals.

In addition, other soldering conditions such as soldering temperature, preheating temperature, specific gravity of flux, and

belt speed affect the occurrence of bridges.

Depending on flux to be applied, markings may, though at rare case, disappear or fade out at soldering. Please make sure

before its use.

Flow direction

Vertical

Parallel

CS-4-13NA, NB

CS-4-22YA, YB

CS-4

ROTARY SELECTOR SWITCHES (SMD)

P.C.B.

Solder

bath

P.C.B.

Solder

bath