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LF80539KF0412M 数据表(PDF) 2 Page - Intel Corporation

部件名 LF80539KF0412M
功能描述  Dual-Core Intel짰 Xeon짰 Processors LV and ULV for Embedded Computing
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

LF80539KF0412M 数据表(HTML) 2 Page - Intel Corporation

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• Intel® E7520 chipset, featuring high bandwidth for increased
memory and I/O throughput with dual-processor support, provid-
ing four high-performance cores per platform (see Figure 1).
• Intel® 3100 chipset, providing a single chip system controller. This
integrated chipset combines the Memory Controller Hub (MCH)
and I/O Controller Hub (ICH) into a single component, significantly
conserving board real-estate and power consumption.
• Two complete execution cores in one processor package
provide advancements in simultaneous computing such as
multi-threaded applications and multi-tasking environments.
Dual-core processing efficiently delivers performance while
balancing power requirements.
• High-performance front-side bus (FSB) provides dual-processor
support for demanding high-performance, volume applications.
Combined with dual-core processing, this supports up to four
simultaneous threads on the system.
• Enhanced Intel SpeedStep® technology allows a system to
dynamically adjust processor voltage and core frequency,
decreasing average power consumption and average
heat production.
• Intel® Smart Cache Design allows two execution cores to
share 2 MB of L2 cache, reducing FSB traffic and enhancing
system responsiveness.
• Intel® Advanced Thermal Manager supports new digital
temperature sensors and thermal monitors on each
execution core to enhance thermal monitoring accuracy.
• Streaming SIMD Extensions 3 (SSE3) provides significant
performance enhancement for multi-media applications.
Additional instructions designed to improve thread synch-
ronization, complex arithmetic, graphics, and video encoding.
• Fully code compatible with existing Intel® architecture-based
32-bit application software.
• Utilizing Intel® Dynamic Power Coordination, application
software or operating system can change the sleep state
of each execution core, allowing the platform to balance
performance and power dissipation.
• FSB address, data, and response parity protection provides
a key reliability and data integrity feature for the communica-
tions, storage, and other embedded market segments.
• Enhanced 36-bit memory addressing supports up to 16 GB
of DDR2 memory, when paired with the Intel E7520 chipset.
• Embedded lifecycle support protects system investment
by enabling extended product availability.
• Along with a strong ecosystem of hardware and software
vendors, including members of the Intel® Communications
Alliance (intel.com/go/ica), Intel helps developers cost-effectively
meet design challenges and shorten time-to-market.
Product Highlights (continued)


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