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SL3ICS1002F7AF 数据表(PDF) 5 Page - NXP Semiconductors

部件名 SL3ICS1002F7AF
功能描述  UCODE G2XM and G2XL
Download  51 Pages
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

SL3ICS1002F7AF 数据表(HTML) 5 Page - NXP Semiconductors

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139037
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 9 October 2012
139037
5 of 51
NXP Semiconductors
SL3ICS1002/1202
UCODE G2XM and G2XL
6.
Wafer layout and pinning information
6.1 Wafer layout
(1) X-scribe line width: 56.4
m
(2) Y-scribe line width: 56.4
m
(3) Chip step, x-length: 488.0
m
(4) Chip step, y-length: 470,0
m
(5) Bump to bump distance X (TP1 - RFN): 351,0
m
(6) Bump to bump distance Y (RFN - RFP): 333,0
m
(7) Distance bump to metal sealring X: 40,3
m
(8) Distance bump to metal sealring Y: 40,3
m
Bump size X x Y: 60
m x 60 m
Fig 2.
Wafer layout and pinning information
001aai346
not to scale!
(1)
(7)
(2)
(8)
(5)
(6)
(4)
(3)
Y
X
TP2
TP1
RFN
RFP


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