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HCPL-0454-500E 数据表(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-0454-500E 数据表(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
7 / 19 page 7 Solder Reflow Temperature Profile Recommended Pb-Free IR Profile 0 TIME (SECONDS) 200 100 50 150 100 200 250 300 0 30 SEC. 50 SEC. 30 SEC. 160 °C 140 °C 150 °C PEAK TEMP. 245 °C PEAK TEMP. 240 °C PEAK TEMP. 230 °C SOLDERING TIME 200 °C PREHEATING TIME 150 °C, 90 + 30 SEC. 2.5 C ± 0.5 °C/SEC. 3 °C + 1 °C/–0.5 °C TIGHT TYPICAL LOOSE ROOM TEMPERATURE PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC. REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC. NOTE: NON-HALIDE FLUX SHOULD BE USED. 217 °C RAMP-DOWN 6 °C/SEC. MAX. RAMP-UP 3 °C/SEC. MAX. 150 - 200 °C * 260 +0/-5 °C t 25 °C to PEAK 60 to 150 SEC. 15 SEC. TIME WITHIN 5 °C of ACTUAL PEAK TEMPERATURE tp ts PREHEAT 60 to 180 SEC. tL TL Tsmax Tsmin 25 Tp TIME NOTES: THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX. Tsmax = 200 °C, Tsmin = 150 °C NOTE: NON-HALIDE FLUX SHOULD BE USED. * RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C |
类似零件编号 - HCPL-0454-500E |
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类似说明 - HCPL-0454-500E |
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